As part of our strategic research agenda Flamac has invested in an automated thin film deposition system:
By appropriate selection of materials, processes, deposition sequences and masking techniques it is possible to create with this equipment a variety of thin film layers for materials research and property screening. The created multilayers can be used as such or can undergo further treatments.

Technologies/available processes in high throughput mode:

  • PVD (Physical Vapour Deposition)
  • PE-CVD (Plasma Enhanced Chemical Vapour Deposition)
  • in situ vacuum heat treatment (annealing, diffusion, alloying)
  • off line rapid thermal processing in a controlled atmosphere



Coating substrates:

  • 100 mm silicon, alumina or glass wafers
  • planar substrates with project specific dimensions
  • Depositions of e.g. 200 μm x 200 μm on photoresistant patterned wafers, as well as simultaneous shadow masked depositions on a series of 20 mm x 20 mm substrates belong to the possibilities.


A major advantage of the equipment is that it is designed for both:

  • materials screening on small samples sizes
  • upscaling to 10 cm x 10 cm


The platform construction:

  • a central carrousel transfer chamber allowing the sample holders to be exchanged in any desired sequence between the process chambers
  • load lock with annealing option
  • 7 deposition chambers in a flexible concept allowing each chamber to be adapted according to the project needs